Mechanical spindle for cutting machine

Multi-wire cutting is new type of cutting processing method that takes abrasive material into semiconductor processing area for grinding through high-speed reciprocating motion of metal wire, and cuts hard and brittle materials into hundreds of thin sheets at the same time. Compared with other technologies, multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. It is the most widely used wafer cutting technology.

The spindle group consists of fixed support shaft, dynamic support shaft and guide wheel, the middle with rod connected. It is widely used in domestic solar panel silicon wafer processing enterprises, sapphire chip processing enterprises, wire cutting machine equipment manufacturing enterprises.

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